Talking about SMT reflow soldering technology Briefly
SMT reflow soldering , also known as return soldering, is a soldering method that does not require any additional solder during the soldering process by remelting the pre-placed solder to form solder joints.
Compared with wave soldering, it has the following advantages:
Second, reflow welding method:
The fourth zone has the highest temperature setting, which can cause the temperature of the weld zone to rise rapidly and improve the wetting force. Advantages: rapid water gasification of flux and organic acid and halide to improve wetting ability; infrared heating radiation wavelength is similar to absorption wavelength, so substrate heating is fast, temperature difference is small; temperature curve control is convenient, elasticity is good; infrared heater High efficiency and low cost.
Disadvantages: poor penetration, shadow effect – uneven heat.
Countermeasure: A hot air circulation is added to the reflow.
2.Infrared hot air reflow soldering.
The speed of convective heat transfer depends on the wind speed, but excessive wind speed will cause component displacement and promote oxidation of the solder joint. The wind speed is controlled at 1.0~1.8m/s. There are two forms of hot air generation: axial fan generation (easy to form laminar flow, which causes the temperature to be unclear) and tangential fan (the fan is installed outside the heater to create a panel vortex to make the first temperature zone available to control precisely).
Adjustment of basic structure and temperature curve:
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