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Precautions for assembly and welding of SMT chip components

574 Published by FASTPCBA 4月 29,2021

In SMT Assembly processing, there are many types of components, of which chip components are the key to the SMT Assembly welding technology, which has an impact on product quality and reliability. Chip components are miniature electronic components, and there are many types of them, with different shapes and physical properties. The following matters need to be paid attention to when mounting and soldering:

1. Before welding, it is necessary to understand whether there are special requirements for components, such as welding temperature conditions, assembly methods, etc. Some components cannot be immersed in tin, but can only be soldered with an electric soldering iron, such as chip potentiometers and aluminum electrolytic capacitors, so you need to choose the correct soldering method according to the situation.

2. For the components that need immersion tin soldering, it is probably only immersed once. Repeated tin immersion will cause the printed board to bend and the components to crack.

3. In the SMT Assembly welding process, in order to prevent electrostatic damage to the components, the electric soldering iron and soldering furnace used should have a good grounding device.

4. For the selection of printed boards, the thermal deformation should be small and the copper foil coating should be strong. Due to the narrow traces of the copper foil for surface assembly and the small pads, if the anti-stripping ability is insufficient, the pads are easy to peel off. Generally, epoxy glass fiber substrates are used.

5. For rectangular chip capacitors, use larger-looking capacitors, such as type 1206, which is easy to weld, but cracks and other thermal damage are likely to occur due to uneven welding temperature; use smaller-looking capacitors, such as type 0805, although Welding is more difficult, but cracks and thermal damage are less likely to occur, and the reliability is high.

6. If the PCB board needs to be repaired, the number of disassembly and assembly of components should be reduced as much as possible, because multiple disassembly and assembly will result in the complete scrap of the printed board. In addition, for mixed printed boards, if interposing components hinder the disassembly and assembly of chip components, they can be removed first.

In SMT Assembly, the welding of chip components is very complicated. The operator should learn the welding skills and understand the precautions clearly, and operate carefully to avoid errors and affect the welding quality.

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