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PCBA assembly technology: the difference between SMT and THT

170 Published by FASTPCBA 2月 27,2021

SMT is commonly referred to as surface mount technology, which is a circuit board preparation technology in which components are attached to the surface of the circuit board. This is compared to through-hole technology (THT), where various electronic components are fixed in holes drilled through the circuit board. Each of these PCBA assembly techniques has various advantages that make it suitable for a given process rather than another process.

What are the advantages of SMT and THT in PCB assembly?

Advantages of SMT

It allows the installation of small parts, causing minimal surface damage to the installed parts.
This process is easier to perform and relatively inexpensive than the traditional THT welding process.
Since SMT does not involve drilling, the circuit board remains intact and more stable in structure

Advantages of THT

Although SMT and THT play an important role in determining the quality of the plates produced, neither of them has a greater advantage than other sectors. In fact, if used properly, they will effectively complement each other. However, using THT instead of SMT in PCBA assembly has some advantages, including the following.

Through-hole assembly technology can firmly limit assembled parts
TH technology is also suitable for double-ended current transmission in the schematic of a given circuit board.

FASTPCBA SMT chip processing plant: Another notable feature of SMT and THT is the nature of soldering on the circuit board. In SMT, components are soldered on the surface of the circuit board, while THT allows components to be drilled at the back end of the PCBA test. Imagine a capacitor with solder legs and a fuse without soldering. These components should be properly soldered on the surface of the circuit board to make it function effectively. “Legs” components such as capacitors and control knobs are fixed using THT technology, while components without hooks or “legs” are mounted on the surface of the circuit board using SMT technology.

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