Selective Wave Soldering Furnace Advantages and Disadvantages
Selective Wave Soldering Machine is a compromise solution for the PCBA board assembly craft, since electronic components have not been able to completely eliminate the traditional plug-in (THT, Through-Hole Technology) process of (DIP, Dual-line In Package) which possibly relate to price or the materials themselves.
In a word, while most of the parts on the board can go through the SMT process, there are still some electronic parts that can only maintain the through-insertion process, although there is now PIH (Past-In-Hole) or PIP (Pin-In-Paste) technology allows through-hole parts to go through the SMT process, or use wave soldering furnace to select the tray, but it is also due to the baffling of parts technology. Not all through-hole parts are available, so at last there appear such a “Selective Wave Soldering Machine”.
Selective Wave Soldering Machine is actually a little different from the traditional wave soldering furnace. It is actually using the small tin furnace nozzle easy feature to move, fixing the PCB board on the shelves, then move the nozzle of small tin furnace liquid placed under the PCB, and with small tin furnace liquid contact solder feet of THT or DIP traditional plug-in parts to achieve the solder effect.
The small Tin furnace nozzle of the Selective Wave Soldering Machine is a bit like the impression of the fountain in our impression. The molten tin liquid will flow from the nozzle of the small tin furnace nozzle. It is the same as the “spoiler wave” in the wave soldering, which achieves the purpose of soldering the traditional through-hole parts. The absorbed soldering effect is certainly better than the through-hole filling rate of the SMT process, and almost can be filled 100%, and Parts do not need to withstand high temperatures to Reflow temperature, but the disadvantage is need to avoid the small tin furnace nozzle space.
The advantages and disadvantages of the Selective Wave Soldering Machine are listed below.
Advantages of a selective wave soldering furnace:
1. No special fixtures or oven trays are required during welding.
2. Through-hole parts do not require materials that are resistant to Reflow. Using general wave soldering conditions is okay.
3. Good weld quality and through hole fill rate can be obtained when welding.
4. Save energy. There is no need to have a large tin furnace like wave soldering furnace, and there is no need for such long heating zone as reflow oven to reach the purpose.
5. The avoidance zone is smaller than the wave soldering to make the oven tray.
6. The board is not easily bent and deformed due to high temperatures.
7. Save time compared to traditional wave soldering and SMT.
Disadvantages of selective wave soldering furnace:
1. An additional device must be purchased.
2. larger avoidance area must be retained compared to the SMT process.
3. It is necessary to write a program, which is a waste of pre-production time. But once you write it for the first, you can reuse it.
PCB manufacturer reflow soldering machine heating system The full hot air and infrared hea...
Types and advantages of flexible pcb circuit board The PCBA board is the finished product after t...
What are the SMT process Everyone knows that the electronic products we use in our lives are ass...
What is the difference between PCB and PCBA What is a PCB PCB = printed circuit board; PCB is an ...