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PCB Manufacturing ICT Misjudgment Cause Analysis

Although ICT is powerful, there are still some misjudgments, mainly reflected in the following aspects.

  1. ICT cannot test parts including memory IC (EPROM. SRAM, DRAM…); small capacitors with 10 times or more in parallel; large capacitors of 20 times or more in parallel; D/L, D cannot measure: Functional test of IC
PCB Manufacturing ICT Misjudgment Cause Analysis

PCB Manufacturing ICT Misjudgment Cause Analysis

  1. The fixture is not corrected.
  2. The press-in amount of the pressmachine is insufficient, and the probe press-in amount should be 1/2-2/3.
  3. There is residual rosin on the PCB after the no-clean procedure, resulting in poor probe contact.
  4. The PCB manufacturing positioning post is loose, causing the probe contact area to deviate from the pad.
  5. The fixture probe is badly damaged.
  6. Parts library card changes (11% can be relaxed, IC can be re-identified)
  7. ICT itself has some faults that affect measurement accuracy.
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