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PCB maker solder paste spray printing technology development trend

197 Published by FASTPCBA 11月 01,2019

PCB maker solder paste spray printing technology development trend

 

There is no doubt that pcb maker‘s solder paste spray printer technology is one of the most revolutionary new technologies in the field of SMT equipment in recent years. It changed the traditional screen printing mode, which was successfully developed by MYDATA Sweden and applied to the newly introduced MY500 solder paste spray printer. The solder paste spray printer moves at the pad of the printed board at a speed of 500 points per second. Slide up and spray print solder paste. The solder paste enters a sealed pressure chamber through a screw rod and is then pressed out by a pressure bar. Since there is no need for a stencil, it has many advantages, which greatly reduces the time for production conversion and delivery. The principle of solder paste printing is shown in Figure 4-44.

PCB maker solder paste spray printing

PCB maker solder paste spray printing

Like a computer inkjet printer, the MY500 is divided into three parts: the spray printer itself, the spray print head and solder paste box, and off-line programming software.

 

The pcb maker replace solder paste box is as easy as replacing the ink cartridge with an inkjet printer. Although the capacity is only 100g, the solder paste is contained in a sealed container with almost no loss, and the actual usage is very economical. MY500 does not require steel plates, cleaning agents, wiping papers and solder paste mixers. MY500 has a great effect under the pressure of various types and heavy production tasks. The MY500 is also known for its speed, which sprays solder paste at 500 points per second, which is 1800000 points per hour. Equipped with an easy-to-use touch screen interface, the touch screen is located on the side of the printer and is available to the operator during printer setup.

 

MY500 uses Circuit CAM offline data programming software, which can directly convert and generate printing programs from CAD files of various formats, and the programming efficiency is greatly improved. In the production process, it is not necessary to adjust the blade pressure, speed or other screen printing parameters. The program is completely controlled by software. The amount of solder paste can be adjusted as needed, and the amount of solder paste for each component or individual pads can be controlled. This is not possible in traditional screen printer. Because solder paste printing technology has many advantages, once it is launched, it has attracted the attention of many industry pcb makers. Solder paste printing will become a direction for the development of solder paste printing technology in the future. Solder paste printing system has the following advantages

 

No need for template, cleaning agent, wiping paper, steel plate cleaning machine, solder paste mixer, storage space and management cost, etc. Under the pressure of various types and heavy production tasks, the solder paste spray printing system can really help save cost. Many are successful and reduce pollution to the environment.

 

2) The coating procedure is completely controlled by software. Offline programming can be used to adjust the amount of solder paste as needed. It can also control the amount of solder paste for each package, component or individual pads, or select layered solder paste to solder. The paste is piled up in layers, and these changes take only a few seconds without having to adjust the blade pressure, speed or other steel plate printing parameters.

3) The operating platform is simple, does not take up too much space, and can also be used with a bar code reader to prevent misuse of solder paste in various solder paste models.

4) The structure is simple and the equipment maintenance cost is low. Solder paste printing is a very important process in SMT production. In order to improve the printing quality, pcb maker has tried all possible methods and ways, including the change of solder paste from open environment to dense atmosphere and closed-loop control of pressure. In the new solder paste printing technology, solder paste printing is undoubtedly the most dazzling star, and one of the most promising new technologies. It completely breaks through the limitations of traditional printing technology mode, making process control easier and more flexible. It is foreseeable that solder paste printing will be used more in electronic assembly, which may replace the dominant position of traditional screen printing technology.

 

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