Introduction of PCB assembly substrate material classification
PCB assembly substrate, as the name suggests, is fundamental, is the basic material for manufacturing PCB circuit board. Generally,PCB substrate is composed of resin, reinforcing material, and conductive material, there are many kinds.Epoxy resin and phenolic resin are common resins. Reinforcing materials include paper base and glass cloth. Copper foil is the most commonly used conductive material,copper foil is divided into electrolytic copper foil and rolled copper foil.
The reason why I talk to you about this basic thing is that sometimes in the process of customer consultation, FAQ, some customers will mention that they need to know whether the manufacturer has done a material board, especially the foreign requirements and our domestic requirements are slightly different, such as the difference in the fire rating.Therefore, I would like to talk about the classification of PCB substrate materials with you, and also hope that you can become more and more professional in your daily accumulation, so that you can calmly deal with different needs of customers, win customers with your expertise, and don’t miss any opportunities to cooperate with customers.
PCB substrate material classification as below:
I.Different reinforcement materials:
1, Paper substrate (FR-1，FR-2，FR-3);
2, Epoxy glass fiber cloth substrate (FR-4，FR-5);
3, Composite base plates (CEM-1，CEM-3(Composite Epoxy Material Grade-3);
4, HDI(High Density Interconnect) plate (RCC);
Ii. According to flame retardant performance:
1, Flame retardant(UL94-V0，UL94V1);
2, Non-flame retardant (UL94-HB)
Iii. According to the resin:
1, Phenolic resin board;
2, Epoxy resin board;
3, Polyester resin board;
4, BT resin board;
5, PI resin board.
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