FASTPCBA adopts industry-leading multi-function patch machine, equipped with 10-temperature zone reflow furnace, wave-peak welding, BGA repair table,AOI, X-ray detection equipment, existing SMT production line 4, 2 after welding, assembling, testing complete set flow production line.
1. Mark points are round or square with a diameter of 1.0mm. Depending on SMT equipment, the copper area around Mark points should be larger than 2.0mm.
2. The four corners of each large board must have Mark points or two Mark points at opposite angles, and Mark points should be greater than 5mm from the edge;
3.Each board must have two Mark points.
4. According to specific equipment and efficiency evaluation, no “X” board is allowed in FPC jigsaw;
5. During plate patching, the key areas shall be glued firmly with wide adhesive paper, and the film shall be checked again. If the plate is not smooth, it shall be pressurized again and the film shall be checked again.
6. 0402 element pad spacing is 0.4mm;The spacing between elements 0603 and 0805 is 0.6mm.It is best to square the welding pad;
7. In order to avoid the small area of FPC board, due to the undercutting subsidence, the underside should be flushed.
8. After FPC board is made, it must be vacuum-packed after baking;It’s best to pre-bake the SMT before it goes on line.
9. The best size of the panel is within 200mmX150mm;
10. Four SMT fixture positioning holes shall be left on the edge of the split plate, with a diameter of 2.0mm;
11. The minimum distance from the edge of the plywood edge element to the edge is 10mm;
12. As far as possible, each small plate is distributed in the same direction;
13. Each small plate gold finger area (i.e., hot pressing end and soldable end) is made into a piece to avoid eating tin in SMT production;
14. The minimum distance between Chip component pads is 0.5mm.
Engineering designers and technologists are expected to have such experience: after the completion of FPC production, components need to be welded by SMT;The problem is that as a good designer, you need to know some special requirements about SMT process in advance to maintain high quality and high efficiency in SMT production.Because FPC in the SMT process to the board itself flatness requirements are particularly high;In addition, the space, MARK point setting, size of plywood and other factors will affect the quality and efficiency of SMT. Therefore, as a design engineer of FPC manufacturer, he should know more about some special requirements of SMT and consider the design before manufacturing with FPC manufacturing capacity.
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