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Introduction to PCB classification

344 Published by FASTPCBA 8月 27,2018

Introduction to PCB classification

I. Advanced curved PCB:

The advanced curved PCB is a multilayer composite wiring board that presses printed wiring board (PWB) and flexible PCB (FPC) together in a multi-layer structure.PWB and FPC have copper plated through holes connected to each other.The circuit board is best suited for small, lightweight equipment.

Features:

(1) the new model with the following specifications can be used as the best solution for mobile phone use.

· minimum base thickness: 0.3mm (4 layers), 0.39mm (6 layers)

· minimum line width/interval: 0.075mm/0.075mm

Type, single or double sided soft PCB (FPC) and flexibility (as folding) : radius of 3 mm, 180 °, folding, folding 200 more than 000 times.

(2) the device can be connected without contact, with small spacing, and can be assembled very tightly in 3d space.

(3) in the multi-layer (3-8 layers) part, electroplating holes are used to realize the connection between plates, thus greatly enhancing the reliability.

(4) the convenience of assembly is equivalent to the common printing wiring board.

(5) the specification of “chip on hole” can be provided, so that “Blind via Holes” can be used as chip bonding pads.

PCB

II. Flexible composite multi-layer PCB

The advanced curved PCB is a multilayer composite wiring board that presses printed wiring board (PWB) and flexible PCB (FPC) together in a multi-layer structure.PWB and FPC have copper plated through holes connected to each other.The circuit board is best suited for small, lightweight equipment.

Features:

(1) the flexible PCB (FPC) is used to connect multiple pressing layers internally, thus improving the connection reliability between the multilayer circuit boards and reducing the space occupied by the connection and the weight of the joint.

(2) the CSP with narrow spacing (0.5mm) and the bare chip are installed, thus realizing the installation of ultra-high density and making the equipment more compact and exquisite.

(3) the “internal connection and through-hole connection” and structural layering are realized, so the wiring design of ultra-high density can be obtained.(it gives the design more freedom to make the product smaller and thinner.)

flexible PCB

flexible PCB

III. Composite multilayer PCB < solid type specification >

Composite multi-layer PCB can be installed with CSP with spacing of 0.5mm, which can reduce the size and thickness of PCB and realize the high-density installation design.

Features:

(1) small spacing (0.5mm) CSP IC and bare chip can be installed with ultra-high density.

(2) ultra-fine wiring design can be realized by using concave internal through holes and cascading through structures.

multilayer printed circuit board

multilayer printed circuit board

IV.Solid PCB

Sharp’s rugged PCB is capable of sustained good performance over long periods of time and under harsh conditions, and is known for its superior reliability, which meets the needs of users.

Features:

(1) conform to various specifications, such as SMT/COB/ fine mode/multi-layer PCB.

(2) from the CAD design to the completion of the circuit board, it is operated under the system of full-streamline command monitoring.

(3) soft PCB and hard PCB can be combined.

V.Soft PCB

Flexible PCB is designed for increased space utilization and product design flexibility, and can meet the design needs of smaller and higher density installations.It also helps to reduce assembly processes and enhance reliability.

Features:

(1) high-density installation circuit, SMT and other soft PCB are available.

(2) high-precision and other connector mounting types for COF with flip chip mounting and line binding capability can be provided.

PCB classification.

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