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High precise printing assembly for FPC

221 Published by FASTPCBA 4月 01,2019

High precise printing assembly for FPC

Feature: FPC itself should be flat and have basic board to orient marked with MARK. It’s hard to fix FPC and ensure consistency when produce in bulk which need high requirement device.in addition it’s difficult to control printing solder paste and mounting craft.

Process

1.FPC fix up::The supporting board require small thermal expansivity  coefficient for the whole process to fix on from printing assembly to reflow welding.There are two methods, Method A is used when the mounting accuracy is above 0.65mm of QFP lead spacing;method B is used if it’s below 0.65MM.

flexible pcb

flexible pcbPrinting flexible printed circuit Method A:The pallet cover positing template.The flex pcb is fixed on the pallet with thin heat-resistant tape, and then separate the pallet from the positioning template for printing.High temperature resistant tape should have moderate viscosity, be  peeled easily after reflow welding, and without residual adhesive on flexible printed circuit.

Method B:The pallet is custom made,it require tiny shape change craft after several times of thermal shock. The pallet is set with T-shape positing pin which is a little higher than flexible printed circuit.

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