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The printed circuit boards used as SMT Processing Assembly and interconnection must adapt to the rapid development of the current SMT Processing Assembly technology. SMT Processing Assembly printed circuit boards have become the mainstream products of the current SMT Processing Assembly manufacturers. Almost 100% of the circuit boards are It is SMT chip processing, and its function is the same as that of through-hole circuit board processing. SMT Processing Assembly has the following main features:

1. High density: As the number of pins of SMT Processing Assembly is as high as hundreds or even thousands, the center distance between pins can reach 0.3mm, so the high progress BGA on the circuit board requires fine lines and fine spacing, and the line width ranges from 0.2~ The 0.3mm is reduced to 0.1mm or even 0.05mm, and the 2.54mm grid has developed to 4, 5 or even 6 wires. The fine lines and fine pitch greatly improve the assembly density of SMT. Corresponding SMT chip processing equipment can be completed in the case of high precision.

2. Small aperture: most of the metallized holes in SMT are not used to insert component pins, and no welding is carried out in the metallized holes. The metallized holes are only used as electrical interconnections between layers, so To reduce the aperture as much as possible, provide more space for SMT Processing Assembly. The hole diameter has changed from 0.5mm to 0.2mm, 0.1mm or even 0.05mm.

3. Low coefficient of thermal expansion: Any material will expand after being heated. Polymer materials are usually higher than inorganic materials. When the expansion stress exceeds the material’s bearing limit, the material will be damaged. Due to the many and short SMT pins, the CTE between the device body and the SMT is inconsistent, and damage to the device caused by thermal stress often occurs. Therefore, the CTE of the SMT circuit board substrate is required to be as low as possible to adapt to the device The match.

4. Good high temperature resistance: Most of today’s SMT circuit boards require double-sided mounting of components, so the circuit boards processed by SMT are required to withstand two reflow soldering temperatures, and nowadays lead-free soldering is used, and the soldering temperature requirements are higher. And it is required that after soldering, the SMT Processing Assembly circuit board has small deformation and no blistering, the pad still has excellent solderability, and the surface of the SMT Processing Assembly circuit board still has high smoothness.