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Factors affecting SMT patch quality

64 Published by FASTPCBA 12月 12,2018

SMT patch industry as the foundation of electronic products industry, any small details and production links may produce different quality problems, usually affect the quality of our SMT patch factors are mainly as follows: leakage parts, side parts, flip parts, offset, damaged parts and so on.the main cause of patch leakage

1、Components for feed frame (feeder) feeding is not in place, although feida is very expensive, with tears also want to use ah!

2、The air path of the element nozzle is blocked, the nozzle is damaged and the nozzle height is incorrect.

3、Malfunction and blockage of the true air circuit of the equipment.

4、The circuit board is defective in stock and deformed.

5、Circuit board solder pad no solder paste or solder paste is too little.

6、Component quality problems, the thickness of the same variety is not consistent.

7、There are errors and omissions in the procedure of patch machine invocation, or the selection of component thickness parameters is wrong during programming.

8、Human factors accidentally knocked off.

The second:flip parts and side parts

SMC resistor SMC SMC resistor SMC SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC resistor SMC

1. Feeders of components are abnormal.

2. The height of suction nozzle attached to the mounting head is not right.

3. The height of the grasping material of the mounting head is not right.

4. The loading hole size of the component braiding is too large, and the component is turned over due to vibration.

5. Reverse the direction of bulk material in braiding.

Thirdly:offset

The main factors that lead to the deviation of component patch

1. The x-y axis coordinates of components are incorrect when programming the patch machine.

2, patch nozzle reason, so that the suction material is unstable.

Fourthly:damaged parts

The main factors that lead to the damage of component patch

1、The positioning thimble is too high, so that the position of the circuit board is too high, and the components are extruded during mounting.

2、The z-axis coordinates of components are incorrect when programming the patch machine.

3、The nozzle spring attached to the head is stuck.

The overall analysis of several factors affecting SMT patch quality can be obtained from the analysis of two categories of reasons:

1、Problems in our production process, such as machine equipment, programming, material tray, feida, etc.

2、We think there are some unnecessary problems caused by factors.

As a technology-intensive industry, we still need to strictly control every link of quality control. Quality is our life.

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