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Factors affecting PCB manufacturing SMT mounting

 

During pcb manufacturing, the mounting accuracy of SMD on PCB depends on many factors, including PCB design and processing, SMD package form, positioning deviation of the placement machine drive system, etc. The first two involve the quality control of device inlet inspection and PCB design and manufacturing. The latter is obviously related to the performance of the placement machine.

Factors affecting PCB manufacturing SMT mounting

Factors affecting PCB manufacturing SMT mounting

In addition to the PCB positioning carrier device, the X-, Y-, Z- and θ-axis drive systems are the key components for placement machine. The drive form affects the performance of the placement system during pcb manufacturing. When all motion is concentrated on the placement head, the highest placement accuracy is generally achieved, since in this case only two transport mechanisms affect the X-Y positioning error. When both the placement head and the PCB move, the motion errors of the placement head and the PCB workbench mechanism overlap, resulting in an increase in total error and a decrease in mounting accuracy. In order to achieve a higher placement rate, the PCB workbench must move quickly during pcb manufacturing, and its acceleration can reach 10-30m/s2. In this case, due to the inertia of large components, The large components that have been mounted are shifting, causing malfunctions. Therefore, when mounting such components, the movement speed and acceleration of the PCB workbench should be decreased. For this reason, the choice of accuracy and speed often considers a compromise solution during pcb manufacturing.

 

In the open loop state, the drive motor produces a precise feed rate, and the movement of any point on the placement head/PCB carrying platform will have six freedom degrees error: X, Y, Z axial motion and around X, Y, Z axis rotation. Assuming that a drive motor gives X-axis transmission motion, it is not difficult to find that the test point has errors not only in the X-axis motion, but also in the other five axial samples. The magnitude of these errors depends on the nonlinearity of the guide rails during pcb manufacturing. The non-parallelism of the guide rails, the nonlinearity of the drive mech

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