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Double-sided pcb manufacturing advantages and welding requirements

In order to have a reliable conductive effect for the double-sided pcb manufacturing, firstly solder the connection hole on the double-sided board (that is, the through-hole part of the metallization process) , and cut off the protruding portion of the connection wire tip to avoid bruising operator’s hand, this is the board’s wiring preparation.

Double-sided pcb manufacturing advantages and welding requirements

Double-sided pcb manufacturing advantages and welding requirements

The so-called single-sided and double-sided are different in the number of layers of copper during pcb manufacturing.For double-sided, there are copper on both sides of the board, which can be connected through the via hole. There is only one layer of copper on single-side, and only a simple circuit can be used. The holes made can only be used for plug-ins that cannot conduction.

 

The double-sided printed circuit board has two layers of upper and lower conductor patterns, and the upper and lower conductive holes are connected by through-hole conduction. The walls of the perforated holes are plated with a copper layer to conduct the upper and lower layers in pcb manufacturing. The double-sided printed circuit boards are usually made of double-sided copper-clad laminates by screen printing or photoimaging. A resist pattern is formed on the surface of the copper, and the excess copper foil is removed by chemical etching to form a conductor pattern. The via hole is a small hole filled or coated with metal on the PCB, which can be connected to the wires on both sides. Because the area of the double-sided pcb is twice as large as that of the single-sided pcb, the double-sided pcb solves the difficulty of wiring interleaving in a single-sided pcb board (can pass through the via hole to the other side), and it is more suitable more complicated circuit than a single-sided pcb board during pcb manufacturing.

 

The single-sided pcb board is on the most basic PCB, the parts are concentrated on one side, and the wires are concentrated on the other side. Since the wire only appears on one side, this PCB is called single-sided pcb. Because single-panel has many strict restrictions on the design circuit (because there is only one side, the wiring can not cross and must be around the path), so only the early circuit used this type of board during pcb manufacturing.

 

Double-sided pcb board soldering essentials:

  1. For devices that require shaping, the process should be processed according to the requirements of the process drawings; that is, the plug-in is shaped firstly then be plugged in.

 

  1. After the shaping, the model surface of the diode should face upwards, and there should be no inconsistency abouttwo pins lengths.

 

  1. When inserting the device with polarity requirements, it should be noted that the polarity should not be reversed. The roller is integrated with the block componentsduring pcb manufacturing. After the devicesare inserted, both vertical tilt and flat device cannot be tilted obviously.

 

  1. The electric soldering iron used for soldering has a power of 25~40W. The temperature of the soldering iron tip should be controlled at about 242°C. The temperature is too high and the head is easy to “die”during pcb manufacturing.Too low temperature  and the solder can not be melted. The welding time is controlled at 3. ~4 seconds.

5.The formal welding is generally in accordance with the device from short to high, from the inside to the outside      of the welding principle to operate, welding time should be masteredduring pcb manufacturing, too                               long time will    burn the device, it will burn the copper wire on the copper plate.

 

  1. Because it is double-sided soldering, it should manufacture aprocess frame for placing circuit boards, etc., in order not to tilt the device below.

 

  1. After the welding of the circuit board is completed, a full check-in type inspection should be carried out to check the place where the leakage welding is performed. After confirming, the excess device pins of the circuit board are trimmed, and then flow into the nextpcb manufacturing process.

8.In the specific operation, should also strictly follow the relevant process standards to operate, the welding                 quality of the product.

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