Five development trends of PCB technology
In the 21st century, human beings have entered a highly information-based society, and PCB is an indispensable and important pillar in the information industry.
Electronic equipment requires high performance, high speed and thin and short, and as a multidisciplinary industry –PCB is the most critical technology for high-end electronic equipment.PCB products, whether rigid, flexible, rigid-flexible combined multilayer board, and used for IC packaging substrate module substrate, for high-end electronic equipment to make a great contribution.PCB plays an important role in electronic interconnection technology, and we should pay more attention to the development of PCB technology.
1,high density interconnection technology (HDI)
As HDI embodies the most advanced technology of modern PCB, it brings fine wire and small aperture to PCB.Mobile phone (mobile phone) is a model of HDI cutting-edge development technology among multi-layer board application terminal electronic products.In the mobile phone PCB motherboard microwire has become the mainstream, in addition to conductive layer, plate thickness;The microrefinement of conductive graphics brings about high density and high performance of electronic equipment.
Over the past two decades, HDI has promoted the development of mobile phones, LSI and CSP chips (packaging) for information processing and control of basic frequency functions, and template substrates for packaging, as well as the development of PCB. Therefore, it is necessary to develop along the path of HDI.
2,Component embedding technology
Semiconductor device, electronic component or passive component function “embedded PCB” has begun mass production in the inner layer of PCB. Embedded PCB technology is a huge change in PCB function integrated circuit, but to develop must solve the simulation design method, production technology and inspection quality, reliability assurance is the urgent matter.
We need to increase resources in the design, equipment, testing, simulation and other aspects of the system to maintain strong vitality.
3, Material development in PCB
Whether it is rigid PCB or flexible PCB material, with the global lead-free electronic products, it is required to make these materials have higher heat resistance, so new high Tg, small thermal expansion coefficient, small medium constant, dielectric loss Angle tangent excellent materials continue to emerge.
4,photoelectric PCB has a broad prospect
It USES both the optical path layer and the circuit layer to transmit signals. The key to this new technology is to make the optical path layer (optical waveguide layer).It is an organic polymer formed by lithography, laser ablation and reactive ion etching.At present, the technology has been industrialized in Japan and the United States.
5,Update the manufacturing process and introduce advanced equipment
1. Manufacturing process
HDI manufacturing has been mature and tends to be improved. With the development of PCB technology, although the manufacturing methods commonly used in the past still dominate the subtraction method, low-cost processes such as addition method and semi-addition method have begun to emerge.
Nano-technology is used to metallize holes and form PCB conductive pattern.
High reliability, high quality printing method, inkjet PCB process.
2. Advanced equipment
Production of fine wire, high resolution photomask and exposure devices and laser direct exposure devices.
Uniform coating equipment.
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