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What are the characteristics of cleaning agent of pcb assembly

1,044 Published by FASTPCBA 7月 23,2019

What are the characteristics of cleaning agent of pcb assembly

From the characteristics of the cleaning agent, trichlorotrifluoroethane (CFC-113) and methyl chloroform are often used as the main materials of the cleaning agent. CFC-113 has advantages of high degreasing efficiency, strong dissolving power to flux residue, non-toxic, non-flammable, non-explosive, volatile, non-corrosive to components and PCB, and stable in performance. It has long been considered an ideal solvent for post-weld cleaning of printed circuit board assemblies.

However, in recent years, people have found that CFC-113 has a destructive effect on the high-altitude ozone layer via research. In order to avoid the destruction of the global environment, CFC substitutes have been developed, there are mainly three types as below.

cleaning agent

(1) Improved CFC. This solvent introduces hydrogen atom into the chlorofluorocarbon molecule to promote its rapid decomposition in the atmosphere and reduce damage to the ozone layer. It is estimated that it is only about 1/10 of CFC. The alternative solution for this CFC is indicated by HCFC.

(2) Semi-aqueous cleaning agent. It is characterized as it can dissolve both rosin and water, and mainly contains terpene solvents and hydrocarbon mixture solvents. The main components of terpene solvents are hydrocarbons and organic acids, which are biodegradable, do not destroy the ozone layer, are non-toxic, non-corrosive, and have good dissolving power for flux residues.

The main component of the hydrocarbon mixture solvent is a mixture of hydrocarbons and contains polar and non-polar components, which enhances the ability to dissolve various contaminants. Semi-aqueous cleaning agent are currently the most promising alternative solvents.

(3) Water cleaning agent. The composition is polar water-based inorganic substance, which is usually “saponified” with a saponifier and weld residue to form water-soluble fatty acid salt, which is then rinsed with deionized water. This cleaning material is an effective way to replace CFC solvent cleaning and is mainly used for cleaning low density assemblies.

At present, the cleaning agent is continuing to develop in the direction of non-toxic, non-destructive ozone layer and natural environment, no new pollution, and efficient cleaning of high-density SMA….

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