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Circuit board manufacturing solder paste filling and transfer affecting factors

208 Published by FASTPCBA 10月 25,2019

Circuit board manufacturing solder paste filling and transfer affecting factors

 

In actual circuit board manufacturing, factors such as stencil, scraping force and equipment do not always meet the requirements. Template slack, blade deformation, wiping stencil abnormality, PCB warpage or poor support, equipment abnormality (such as not spraying alcohol) will all change state of contact between the stencil and the pad, which affects the consistency of the amount of solder paste.

circuit board manufacturing

circuit board manufacturing

There are many factors affecting the circuit board manufacturing soldering paste bridging. The main influencing factors are not the printing machine parameters but the PCB support and wiping stencil. Therefore, some people regard the printing support and wiping net as the key process in the printing process, which shows its importance.

 

Therefore, in order to obtain good printing results, it is necessary to optimize and control the system from all aspects of equipment selection, printing parameter debugging, PCB support, wiping stencil, electric board design and production.

 

There are two ways for the printing machine to fix the PCB. The first one is the crimping type represented by DEK; the second is the vacuum adsorption type represented by MPM. In the former, due to the supporting effect of the crimping edge, the thickness of the solder paste on the edge will increase significantly, which will bring the circuit board manufacturing welding problem to the device sensitive to the amount of solder paste such as 0.4mm pitch QFP, 0201.

 

In addition, steel stencil damage, such as local craters, scratches, etc., will affect the amount of solder paste changes.

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