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Circuit board manufacturing lead free material development

363 Published by FASTPCBA 10月 30,2019

Circuit board manufacturing lead free material development

 

Lead-free assembly has become an irreversible trend in the circuit board manufacturing assembly industry. Electronic assembly and soldering is a systematic project. For the application of lead-free soldering technology, there are many influencing factors, so that the lead-free soldering technology can be widely applied in the factory. It is necessary to analyze and study the following aspects from the perspective of system engineering.

Circuit board manufacturing lead free material development

Circuit board manufacturing lead free material development

1) Components. Currently developed lead-free solder materials for electronic assembly, the melting point is generally higher than that of Sn63/Pb37 eutectic solder, so components are required to withstand high temperatures, and components are also required to be lead-free, that is, internal connections and terminals of components. (Line) also use lead-free solder materials and lead-free plating.

 

2) PCB. The basic material of the PCB is required to withstand higher temperatures and is not deformed after soldering. The lead-free eutectic alloy material with the number of surface coatings is compatible with the lead-free soldering materials for assembly welding, and the cost is low.

3) Flux. The flux has better redox capability and better wettability to meet the soldering requirements of lead free soldering materials. The flux matches the solder preheat temperature and soldering temperature and meets environmental requirements. Actual tests have shown that no-clean flux is better for lead-free solder soldering.

 

4) Welding equipment. In order to meet the new welding temperature requirements, the length of the preheating zone, heating components, wave soldering grooves, mechanical structure and transmissions must be adapted to the new requirements, the consistency of the material of the tin pot and the solder (compatibility) should be match. In order to improve the soldering quality of the circuit board manufacturing and reduce the oxidation of the solder, it is necessary to use a new and effective suppression of the welding oxidation technology, and to protect the welding technology with an inert gas (such as N2).

5) Waste recycling. It is very difficult to separate Bi and Cu from Ag-based Sn-based lead-free and non-toxic green solder. How to recover Sn/Ag alloy is a new topic. Therefore, the practical process of lead-free solder is smooth or not, which has a great relationship with the coordination between soldering equipment manufacturers, solder manufacturers, flux manufacturers and component manufacturers.

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