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A brief talk about the type and selection of adhesive tape

437 Published by FASTPCBA 4月 16,2018

A brief talk about the type and selection of adhesive tape

Patch glue type: in the SMT process, generally USES the thermosetting type patch glue stick components on the PCB circuit board, the main application of the material for epoxy resin, polypropylene, nitrile propionic acid ester and polyester and so on.There are two kinds of adhesive: epoxy resin adhesive and acrylic adhesive.

1, epoxy resin patch glue, epoxy resin adhesive patch is one of the most commonly used in SMT processing patch glue, its composition is mainly epoxy resin, curing agent, filler and other additives, curing of epoxy resin adhesive patch method is given priority to with the thermal curing.Epoxy resin is a thermosetting type, high viscosity, the binder can be made into liquid, paste, thin films and powders, and other forms, thermosetting adhesives solidified before heating will not soften, not to establish connection.Thermosetting can be divided into one component and two components.adhesive tape

  1. Acrylic adhesive tape.Acrylic laminated adhesive is another kind of adhesive used in SMT patch processing, and its components are mainly acrylic resin, light curing agent and filler, which belong to light curing adhesive.Acrylic resin is also a number of thermosetting adhesives, commonly used as a single group subsystem.Is characterized by stable performance, short curing time and curing, easy to control process conditions, deposit for the room temperature away from light storage conditions, time of year, single bond strength and electrical properties as high epoxy type.adhesive tape

Curing.The curing mode of the adhesive is hot curing and light curing.Photothermal dual curing and ultrasonic curing, in which light curing is rarely used alone.Ultrasonic scratches are usually used to bind the sealant.The most commonly used curing methods in Smt patch processing are heat curing, ultraviolet light/heat curing 2 kinds.adhesive tape

  1. Heat curing.Heat curing is often used in two forms: intermittent heat curing of oven and continuous heat curing of infrared furnace.
  2. Ultraviolet light/heat curing.The uv/heat curing system is a combination of ultraviolet irradiation and heating, which can be used to solidify the adhesives very quickly on the continuous production line.adhesive tape

Selection of rubber patch: how to select the appropriate patch glue, to ensure the SMT production run smoothly, is the most concern of the electronic product craft, the usual practice is to patch glue list of performance indicators, see table, according to the table in each of the selected test and compare several patch glue, choose the good varieties.

The selection of patch glue is as follows:

(1) hot solid patch adhesive is widely used, and the requirements for equipment and process are relatively simple.It is more sufficient to solidify the adhesive, and the fastness is high. Therefore, it is necessary to choose the light solid patch adhesive for the larger components.

(2) it is necessary to consider the requirements of surface assembly process for patch adhesive for pre-curing performance, curing performance and post-curing performance.adhesive tape

(3) the adhesive with lower curing temperature and shorter curing time should be optimized, and the curing conditions of the better patch glue are generally 150 degrees less than 3min and can be cured.

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