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BGA Package process and flow

136 Published by FASTPCBA 4月 13,2021

Last time FASTPCBA shared with you what is the BGA Package (Ball Grid Array Package) and BGA classification, today FASTPCBA continues to share with you what the BGA Package process and flow are.

Three major BGA packaging processes and processes

1. The packaging process of wire bonding PBGA

1.1 Preparation of PBGA substrate
Laminate extremely thin (12~18μm thick) copper foil on both sides of the BT resin/glass core board, and then drill and through-hole metallization. Use conventional PCB plus 3232 technology to make patterns on both sides of the substrate, such as conduction bands, electrodes, and an array of pads for mounting solder balls. Then add a solder mask and make a pattern, exposing the electrode and solder area. In order to improve production efficiency, a substrate usually contains multiple PBG substrates.

1.2 Packaging process
Wafer thinning→wafer cutting→chip bonding→plasma cleaning→wire bonding→plasma cleaning→molded packaging→assembly of solder balls→reflow soldering→surface marking→separation→final inspection→test hopper packaging.

2. FC-CBGA packaging process

2.1 Ceramic substrate
The substrate of FC-CBGA is a multilayer ceramic substrate, and its production is quite difficult. Because the wiring density of the substrate is high, the pitch is narrow, there are many through holes, and the coplanarity of the substrate is relatively high. Its main process is: first co-fire the multilayer ceramic sheet into a multilayer ceramic metalized substrate at high temperature, then make multilayer metal wiring on the substrate, and then electroplating. In the assembly of CBGA, the CTE mismatch between the substrate, the chip, and the PCB is the main factor that causes the failure of CBGA products. To improve this situation, in addition to the CCGA structure, another ceramic substrate-HITCE ceramic substrate can also be used.

2.2 Packaging process
Preparation of wafer bumps -> wafer dicing -> chip flip and reflow soldering -> underfill thermal grease, distribution of sealing solder -> capping -> assembly of solder balls -> reflow soldering -> marking -> separation ->Final inspection->Test->Packaging.

3. The packaging process of wire bonding TBGA

3.1 TBGA carrier tape
The carrier tape of TBGA is usually made of polyimide material. During production, copper is first coated on both sides of the carrier tape, then nickel and gold are plated, and then through holes and through holes are metalized and patterns are produced. Because in this kind of wire bonding TBGA, the package heat sink is the solid body of the package and the core cavity base of the package, so the carrier tape must be bonded to the heat sink with a pressure-sensitive adhesive before packaging.

3.2 Packaging process
Wafer thinning→wafer cutting→chip bonding→cleaning→wire bonding→plasma cleaning→liquid sealant potting→assembly of solder balls→reflow soldering→surface marking→separation→final inspection→testing→packaging.

The main reason for the popularity of BGA Package is that it has obvious advantages, and its unique advantages in packaging density, electrical performance and cost allow it to replace traditional packaging methods. As time goes by, BGA packages will have more and more improvements, and the cost performance will be further improved. BGA packages have flexibility and excellent performance, and the future has a bright future.

I will share with you today, FASTPCBA is an OEM PCB and PCBA Manufacturer, if you have more questions about PCB, PCB Assembly and BGA Package, you can leave a message for consultation.

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