Basic introduction of SMT patch processing

772 Published by FASTPCBA 11月 05,2018

Basic introduction of SMT patch processing

Features of SMT patch tool

High assembly density, small size and light weight of electronic products, the volume and weight of SMT components is only about 1/10 of that of traditional cartridge components. Generally, after adopting SMT, the volume of electronic products is reduced by 40%~60% and the weight is reduced by 60%~80%.

High reliability and strong vibration resistance.Low defect rate of solder joint.

High frequency characteristic is good.Reduced electromagnetic and radio frequency interference.

Easy to realize automation and improve production efficiency.Reduce the cost by 30%~50%.Save materials, energy, equipment, manpower, time, etc.

Why surface mount technology (SMT)?

Electronic products pursue miniaturization, the previous use of the plug – in components has been unable to shrink

Electronic products have more complete functions. The integrated circuit (IC) adopted has no perforated components, especially the large scale and high integrated IC

Mass production, production automation, the factory to low cost high production, produce quality products to meet customer demand and strengthen market competitiveness

pcb smt

pcb smt

Development of electronic components, development of integrated circuits (IC), multiple applications of semiconductor materials

Electronic science and technology revolution is imperative, pursue international trend

Why is a clean – free process applied to surface mount technology?

Products in the production process wash the waste water from the back, bringing water quality, land and even the pollution of animals and plants.

In addition to water cleaning, the use of organic solvents containing chlorofluorocarbons (CFCFC) for cleaning also pollutes and damages the air and atmosphere.

The residue of cleaning agent on the machine plate causes corrosion, which seriously affects product quality.

Reduce cleaning operation and maintenance cost.

No cleaning can reduce the damage caused by the board (PCBA) during movement and cleaning.Some elements are still uncleanable.

Flux residues are controlled and can be used in accordance with product appearance requirements to avoid visual inspection of cleaning conditions.

Residual flux has been continuously improved its electrical properties to avoid electrical leakage in finished products, resulting in any injury.

The process has passed a number of international safety tests, proving that the chemicals in the flux are stable and non-corrosive

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