I.DIP packaging

DIP packaging

DIP packaging

DIL package (also known as DIP package or DIP package, abbreviated as DIP or DIL, is an integrated circuit packaging method, the shape of integrated circuit is rectangular, and there are two parallel metal pins on its two sides, which is called row pin.DIP packing elements can be soldered through holes electroplated on printed circuit boards or inserted into DIP sockets.

Since some of the new components only provide surface mount technology packages, there are many companies that make SMT components into DIP package adapters, which can put the surface mount technology package IC into the adapter, like DIP pack components into bread boards or other circuit primitives with straight insert components.

The profile diagram of the double-in-line package chip

The packaging of the double in-line chip is usually made of plastic or ceramic.Ceramic packaging has good air tightness and is commonly used in equipment requiring high reliability.But most of the double-in-line packaging chips use thermosetting resin.With a curing period of less than 2 minutes, hundreds of chips can be produced.

II.DIP plug-in process

DIP plug-in processing is a part of the whole PCBA processing process. It refers to the manual plug-in processing of large electronic components that cannot be processed into the patch processing. After the wave welding processing and other processes, the finished products of PCBA are finally formed.The process of DIP plug-in processing is more difficult and needs professional technical guidance.In general, its process can be divided into three steps: platforming, wave welding and quality inspection.Next, we will explain the processing steps of each process in detail.

1. Scheduling

Homework personnel according to the BOM list to determine a number of the material and the direction, and arrange to DIP plug-in cord every one of the above, for each employee assigned components, this time is the first sample of confirmation is required, the last one employee, with the BOM list for comparison test, then passed on to quality department personnel to check first.

2. Wave and peak welding

After the first part is confirmed, mass production will be carried out and wave welding will be carried out to fix the electronic components on the PCB.Wave soldering is divided into lead and lead free, according to customer requirements and the size of electronic components to decide whether to carry out lead or lead free soldering.It is necessary to adjust and control the speed of wave soldering chain, the height of soldering and soldering, and the most important processing time, generally 2~3 seconds.At the same time for some electronic components thermal sensitivity strong hand welding processing.Of course, it is necessary to cut the feet of materials after welding.

3. Quality control of quality department

The inspection of quality department is an important process to ensure the quality of PCB board. The solder shall be checked for whether there is Scylla, virtual welding, floating height and so on. Detailed inspection shall be carried out according to the international standard IPC6101 to assist customers and ensure the delivery of products satisfactory to customers.(DIP packaging)

DIP packaging

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